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Episode 38: The Future of Transistor Design and Advanced Packaging

The Circuit·Oct 16, 2023·33:09·pending

About this Episode

Ben Bajarin is joined by guest Huiming Bu from IBM Research to discuss the future of the transistor (design) and advanced packaging. They also discuss some of the larger technology challenges facing the semiconductor industry in the years to come.

Hosts & Guests

B

Ben Bajarin

Host

Jay Goldberg

Host

No transcript available for this episode.

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