英语新闻丨华为发布高端芯片

First high-performance processor to adopt the company's LogicFolding

首款采用“逻辑折叠”技术的高性能处理器亮相

Huawei Technologies Co on Monday unveiled its latest flagship chip, the Kirin 9050 Pro, marking the company's first new high-performance Kirin processor launch at a flagship event since its Mate 40 smartphones global debut six years ago.

华为技术有限公司（Huawei Technologies Co）周一发布最新旗舰芯片——麒麟9050 Pro。这是自六年前华为Mate 40系列智能手机全球发布以来，公司首次在旗舰级活动上推出全新的高性能麒麟处理器。

The chip, which powers Huawei's newly released Mate XT 2 tri-fold smartphone, is the industry's first high-performance processor to adopt the company's LogicFolding technology. The approach rearranges logic units within a single chip into layered stacks — akin to converting a single-floor layout into a duplex — and adds vertical interconnect channels that function like "elevators" to shorten signal paths and reduce latency.

该芯片搭载于华为最新发布的Mate XT 2三折叠智能手机中。据介绍，麒麟9050 Pro是业界首款采用华为“逻辑折叠”技术的高性能处理器。这一技术通过将单个芯片内部的逻辑单元重新排列为分层堆叠结构——类似于将单层建筑改造成复式结构——并增加类似“电梯”的垂直互连通道，从而缩短信号传输路径，降低延迟。

The result is a 42 percent improvement in overall device performance over the previous generation chip, Huawei said.

华为表示，与上一代芯片相比，搭载麒麟9050 Pro的设备整体性能提升了42%。

Yu Chengdong, Huawei's executive director and chairman of the terminal business group, described the chip at the Guangzhou, Guangdong province launch event as "super fast, intelligent and cool" — calling it the most powerful Kirin chip to date.

在广东省广州市举行的发布活动上，华为常务董事、终端业务集团董事长余承东将这款芯片形容为“速度超快、智能十足、酷炫强大”，并称其为迄今为止性能最强的麒麟芯片。

The Kirin 9050 Pro delivers substantial improvements in large-file loading, multitasking, rendering performance and on-device artificial intelligence capabilities, Huawei said.

华为表示，麒麟9050 Pro在大文件加载、多任务处理、图形渲染性能以及端侧人工智能能力方面均实现了显著提升。

According to real-world test data, the chip packs 55 percent more transistors per square millimeter than its predecessor, the Kirin 9030 Pro — jumping from approximately 155 million to 238 million transistors per sq mm in a single generation.

根据实际测试数据，该芯片每平方毫米晶体管数量较上一代麒麟9030 Pro增加55%，单代产品从约1.55亿个晶体管提升至每平方毫米约2.38亿个晶体管。

The Lingxi CPU delivers a 24 percent increase in single-core peak performance and a 52 percent boost in multi-core concurrent performance.

麒麟9050 Pro搭载的灵犀CPU，单核峰值性能提升24%，多核并发性能提升52%。

The breakthrough comes from LogicFolding, a concept rooted in what Huawei calls the "Tau Scaling Law" — a theoretical framework first proposed by He Tingbo, president of Huawei's semiconductor business, in May.

这一技术突破源于“逻辑折叠”理念，其理论基础来自华为提出的“韬定律”。该理论框架由华为半导体业务负责人何庭波于今年5月首次提出。

On Friday, He published her third update in less than four months on the ChinaXiv preprint platform, a paper directly addressing industry skepticism about whether dense 3D stacking would inevitably lead to higher power density and heat.

周五，何庭波在中国科技论文预发布平台ChinaXiv上发布了不到四个月内的第三次更新论文，直接回应了业界关于“高密度三维堆叠是否必然导致功耗密度升高和散热问题加剧”的质疑。

He's answer is a definitive no. The paper explains that the majority of energy consumption in modern chips comes not from computation itself, but from moving data across long on-chip wires — a phenomenon she likens to a worker's daily energy being consumed not by desk work, but by commuting. Logic-Folding replaces long horizontal journeys with short vertical connections — the chip's "elevators" — cutting typical core wiring length by about 20 percent and reducing some critical paths by up to 70 percent.

何庭波给出的答案是否定的。论文解释称，现代芯片的大部分能耗并非来自计算本身，而是来自芯片内部长距离数据传输。她将这一现象比作员工日常消耗的能量并非主要用于办公，而是耗费在上下班通勤过程中。“逻辑折叠”技术通过将长距离的水平传输转换为短距离的垂直连接——也就是芯片中的“电梯”——减少数据移动距离。据介绍，该技术可使核心线路平均长度缩短约20%，并将部分关键路径缩短幅度最高提升至70%。

She emphasized that "Tau is a time-scaling law, not an energy-scaling law" — the real value lies in converting saved time into lower voltage and frequency, rather than chasing peak performance at the cost of efficiency.

何庭波强调：“韬定律是一种时间尺度定律，而不是能量尺度定律。”其真正价值在于将节省下来的时间转化为更低的电压和频率，而不是以牺牲能效为代价追求峰值性能。

Xiang Ligang, director-general of the Information Consumption Alliance — a telecom industry association, said that for Huawei, the Kirin 9050 Pro represents more than just a performance upgrade — it's a statement that the company's chip design capabilities continue to advance even as its access to US-related advanced chip manufacturing equipment remains constrained.

信息消费联盟（一个电信行业协会）理事长项立刚表示，对于华为而言，麒麟9050 Pro不仅意味着一次性能升级，更表明即使在获取美国相关先进芯片制造设备受到限制的情况下，公司芯片设计能力仍在持续提升。

The Kirin 9050 Pro's debut also comes as the global foldable smartphone market reaches a historic inflection point.

麒麟9050 Pro的发布，也正值全球折叠屏智能手机市场进入历史性转折阶段。

Counterpoint Research said cumulative global foldable smartphone shipments are expected to surpass 100 million units by the end of 2026 — some eight years after the first commercial foldable device launched in 2019.

市场研究机构Counterpoint Research表示，到2026年底，全球折叠屏手机累计出货量预计将超过1亿部。这一里程碑距离首款商用折叠屏设备于2019年推出约八年时间。

The research firm projects the market will accelerate to 37 percent year-on-year growth in 2027, driven by Samsung's Galaxy Z Fold8 series and Apple's anticipated entry into the foldable segment.

该机构预计，2027年折叠屏手机市场增速将达到37%的同比增长。推动市场增长的主要因素包括三星Galaxy Z Fold8系列产品以及苹果预计进入折叠屏手机市场。

unveil /ʌnˈveɪl/ v.发布；揭晓；推出

flagship chip /ˈflæɡʃɪp tʃɪp/ n.旗舰芯片

mark the first time that... /mɑːrk ðə fɜːrst taɪm/ phr.标志着首次……

improve overall performance /ɪmˈpruːvˌəʊvərˈɔːl pəˈfɔːməns/ phr.提升整体性能

deliver improvements in /dɪˈlɪvə(r) ɪmˈpruːvmənts ɪn/ phr.在……方面实现提升

address industry skepticism /əˈdresˈɪndəstriˈskeptɪsɪzəm/ phr.回应行业质疑

remain constrained by /rɪˈmeɪn kənˈstreɪnd baɪ/ phr.受到……限制

reach an inflection point /riːtʃ ən ɪnˈflekʃn pɔɪnt/ phr.达到转折点

year-on-year growth /ˌjɪər ɒnˈjɪərɡrəʊθ/ n.同比增长